Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9282640 | Interconnection element with posts formed by plating | Kimitaka Endo, Sean Moran | 2016-03-08 |
| 8884448 | Flip chip interconnection with double post | — | 2014-11-11 |
| 8558379 | Flip chip interconnection with double post | — | 2013-10-15 |
| 8505199 | Method of fabricating an interconnection element having conductive posts | Kimitaka Endo, Sean Moran | 2013-08-13 |
| 7253504 | Integrated circuit package and method | Jun Zhai, Richard C. Blish, II | 2007-08-07 |
| 6842662 | Method and apparatus for fully aligned flip-chip assembly having a variable pitch packaging substrate | Jaime Weidler, Robert A. Newman | 2005-01-11 |