Issued Patents All Time
Showing 26–50 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587909 | High bandwidth die to die interconnect with package area reduction | Chonghua Zhong, Kunzhong Hu | 2023-02-21 |
| 11561144 | Wearable electronic device with fluid-based pressure sensing | Caleb C. Han, Brad G. Boozer, Mark G. Walsh, William S. Lee, Tongbi Jiang +6 more | 2023-01-24 |
| 11545455 | Semiconductor packaging substrate fine pitch metal bump and reinforcement structures | Jun Chung Hsu, Chih-Ming Chung, Yifan Kao, Young Doo Jeon, Taegui Kim | 2023-01-03 |
| 11532563 | Package integration using fanout cavity substrate | Karthik Shanmugam, Rajasekaran Swaminathan | 2022-12-20 |
| 11515261 | Multiple component integration in fanout package with different back side metallization and thicknesses | Karthik Shanmugam | 2022-11-29 |
| 11476203 | Die-to-die routing through a seal ring | Sanjay Dabral | 2022-10-18 |
| 11404337 | Scalable extreme large size substrate integration | Kunzhong Hu, Chonghua Zhong, Jiongxin Lu | 2022-08-02 |
| 11398456 | Wafer level integration of passive devices | — | 2022-07-26 |
| 11317573 | Modular vertical water storage greening system | — | 2022-05-03 |
| 11309246 | High density 3D interconnect configuration | Sanjay Dabral, Zhitao Cao, Kunzhong Hu | 2022-04-19 |
| 11217563 | Fully interconnected heterogeneous multi-layer reconstructed silicon device | — | 2022-01-04 |
| 11158607 | Wafer reconstitution and die-stitching | Sanjay Dabral, Kwan-Yu Lai, Kunzhong Hu, Vidhya Ramachandran | 2021-10-26 |
| 11158621 | Double side mounted large MCM package with memory channel length reduction | Chonghua Zhong, Kunzhong Hu | 2021-10-26 |
| 11101732 | Power management system switched capacitor voltage regulator with integrated passive device | Sanjay Dabral, David A. Secker, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao | 2021-08-24 |
| 11069665 | Trimmable banked capacitor | Vidhya Ramachandran, Chonghua Zhong, Long Huang, Mengzhi Pang, Rohan U. Mandrekar | 2021-07-20 |
| 11063046 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Emerson S. Fang, Shawn Searles | 2021-07-13 |
| 11056373 | 3D fanout stacking | Kwan-Yu Lai, Kunzhong Hu | 2021-07-06 |
| 10985107 | Systems and methods for forming die sets with die-to-die routing and metallic seals | Sanjay Dabral | 2021-04-20 |
| 10943869 | High density interconnection using fanout interposer chiplet | Chonghua Zhong, Kunzhong Hu | 2021-03-09 |
| 10818632 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Vidhya Ramachandran, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2020-10-27 |
| 10770433 | High bandwidth die to die interconnect with package area reduction | Chonghua Zhong, Kunzhong Hu | 2020-09-08 |
| 10756622 | Power management system switched capacitor voltage regulator with integrated passive device | Sanjay Dabral, David A. Secker, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao | 2020-08-25 |
| 10685948 | Double side mounted large MCM package with memory channel length reduction | Chonghua Zhong, Kunzhong Hu | 2020-06-16 |
| 10631410 | Stacked printed circuit board packages | Corey S. Provencher, Meng Chi Lee, Derek Walters, Ian A. Spraggs, Flynn Carson +9 more | 2020-04-21 |
| 10468381 | Wafer level integration of passive devices | — | 2019-11-05 |