Issued Patents All Time
Showing 51–75 of 97 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10411012 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Emerson S. Fang, Shawn Searles | 2019-09-10 |
| 10290620 | Package with SoC and integrated memory | John Bruno, Timothy J. Millet | 2019-05-14 |
| 10181455 | 3D thin profile pre-stacking architecture using reconstitution method | Chonghua Zhong, Kunzhong Hu, Se Young Yang | 2019-01-15 |
| 10103138 | Dual-sided silicon integrated passive devices | Vidhya Ramachandran, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong | 2018-10-16 |
| 10056384 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Emerson S. Fang, Shawn Searles | 2018-08-21 |
| 10056327 | SOC with integrated voltage regulator using preformed MIM capacitor wafer | Kunzhong Hu | 2018-08-21 |
| 10041847 | Various stress free sensor packages using wafer level supporting die and air gap technique | Caleb C. Han, Tongbi Jiang | 2018-08-07 |
| 9935087 | Three layer stack structure | Kunzhong Hu | 2018-04-03 |
| 9935076 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Vidhya Ramachandran, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2018-04-03 |
| 9883822 | Biometric sensor chip having distributed sensor and control circuitry | Milind S. Bhagavat | 2018-02-06 |
| 9847284 | Stacked wafer DDR package | — | 2017-12-19 |
| 9748227 | Dual-sided silicon integrated passive devices | Vidhya Ramachandran, Kunzhong Hu, Mengzhi Pang, Chonghua Zhong | 2017-08-29 |
| 9728481 | System with a high power chip and a low power chip having low interconnect parasitics | Abraham Yee, Joe Greco, Joseph Minacapelli, John Chen | 2017-08-08 |
| 9691701 | SOC with integrated voltage regulator using preformed MIM capacitor wafer | Kunzhong Hu | 2017-06-27 |
| 9679187 | Finger biometric sensor assembly including direct bonding interface and related methods | Milind S. Bhagavat, Patrick E. O'Brien, Dale R. Setlak, David D. Coons, Kwan-Yu Lai | 2017-06-13 |
| 9679801 | Dual molded stack TSV package | Kwan-Yu Lai, Kunzhong Hu, Flynn Carson | 2017-06-13 |
| 9661411 | Integrated MEMS microphone and vibration sensor | Caleb C. Han, Tongbi Jiang | 2017-05-23 |
| 9659907 | Double side mounting memory integration in thin low warpage fanout package | Kunzhong Hu, Chonghua Zhong, Mengzhi Pang, Se Young Yang | 2017-05-23 |
| 9633974 | System in package fan out stacking architecture and process flow | Kunzhong Hu, Kwan-Yu Lai, Mengzhi Pang, Chonghua Zhong, Se Young Yang | 2017-04-25 |
| 9624093 | Method and apparatus of making MEMS packages | Tongbi Jiang | 2017-04-18 |
| 9601471 | Three layer stack structure | Kunzhong Hu | 2017-03-21 |
| 9595526 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Emerson S. Fang, Shawn Searles | 2017-03-14 |
| 9595514 | Package with SoC and integrated memory | John Bruno, Timothy J. Millet | 2017-03-14 |
| 9589936 | 3D integration of fanout wafer level packages | Kunzhong Hu, Flynn Carson | 2017-03-07 |
| 9583472 | Fan out system in package and method for forming the same | Chih-Ming Chung, Yizhang Yang | 2017-02-28 |