Issued Patents All Time
Showing 26–50 of 102 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6740221 | Method of forming copper interconnects | Liang-Yuh Chen | 2004-05-25 |
| 6658763 | Method for heating and cooling substrates | Ratson Morad, Ho Seon Shin, Igor Kogan | 2003-12-09 |
| 6645550 | Method of treating a substrate | Yezdi Dordi, Jennifer Meng Chu Tseng | 2003-11-11 |
| 6635157 | Electro-chemical deposition system | Yezdi Dordi, Donald Olgado, Ratson Morad, Peter Hey, Mark Denome +10 more | 2003-10-21 |
| 6572010 | Integrated solder bump deposition apparatus and method | Yezdi Dordi | 2003-06-03 |
| 6492722 | Metallized interconnection structure | Chiu H. Ting | 2002-12-10 |
| 6477787 | Method and apparatus for heating and cooling substrates | Ratson Morad, Ho Seon Shin, Igor Kogan | 2002-11-12 |
| 6455415 | Method of encapsulated copper (Cu) interconnect formation | Sergey Lopatin | 2002-09-24 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Barry Chin, Liang-Yuh Chen, Peijun Ding, Yezdi Dordi +3 more | 2002-08-20 |
| 6400030 | Self-aligning vias for semiconductors | Fei Wang, Mark S. Chang, Richard J. Huang, Angela T. Hui | 2002-06-04 |
| 6357143 | Method and apparatus for heating and cooling substrates | Ratson Morad, Ho Seon Shin, Igor Kogan | 2002-03-19 |
| 6323135 | Method of forming reliable capped copper interconnects/with high etch selectivity to capping layer | Minh Van Ngo | 2001-11-27 |
| 6319616 | Scaled interconnect anodization for high frequency applications | Sergey Lopatin | 2001-11-20 |
| 6276072 | Method and apparatus for heating and cooling substrates | Ratson Morad, Ho Seon Shin, Igor Kogan | 2001-08-21 |
| 6271120 | Method of enhanced silicide layer for advanced metal diffusion barrier layer application | Richard J. Huang | 2001-08-07 |
| 6259160 | Apparatus and method of encapsulated copper (Cu) Interconnect formation | Sergey Lopatin | 2001-07-10 |
| 6258223 | In-situ electroless copper seed layer enhancement in an electroplating system | Daniel Carl, Yezdi Dordi, Peter Hey, Ratson Morad, Liang-Yuh Chen +2 more | 2001-07-10 |
| 6258220 | Electro-chemical deposition system | Yezdi Dordi, Donald Olgado, Ratson Morad, Peter Hey, Mark Denome +10 more | 2001-07-10 |
| 6245670 | Method for filling a dual damascene opening having high aspect ratio to minimize electromigration failure | Sergey Lopatin | 2001-06-12 |
| 6239494 | Wire bonding CU interconnects | Paul R. Besser | 2001-05-29 |
| 6225210 | High density capping layers with improved adhesion to copper interconnects | Minh Van Ngo | 2001-05-01 |
| 6200913 | Cure process for manufacture of low dielectric constant interlevel dielectric layers | Lu You, Simon S. Chan, John A. Iacoponi, Richard J. Huang | 2001-03-13 |
| 6153521 | Metallized interconnection structure and method of making the same | Chiu H. Ting | 2000-11-28 |
| 6153523 | Method of forming high density capping layers for copper interconnects with improved adhesion | Minh Van Ngo | 2000-11-28 |
| 6136163 | Apparatus for electro-chemical deposition with thermal anneal chamber | Ashok Sinha, Avi Tepman, Dan Carl | 2000-10-24 |