| 10163798 |
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same |
Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama |
2018-12-25 |
| 10163810 |
Electromagnetic interference shielding for system-in-package technology |
Eric J. Li, Yoshihiro Tomita, Nachiket R. Raravikar |
2018-12-25 |
| 10156583 |
Method of making an accelerometer |
Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more |
2018-12-18 |
| 10128225 |
Interconnect structures with polymer core |
Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Shan Zhong, Robert M. Nickerson |
2018-11-13 |
| 10090277 |
3D integrated circuit package with through-mold first level interconnects |
Debendra Mallik |
2018-10-02 |
| 10070524 |
Method of making glass core substrate for integrated circuit devices |
Qing Ma, Quan Tran, Johanna M. Swan, Valluri Rao |
2018-09-04 |
| 10056182 |
Surface-mount inductor structures for forming one or more inductors with substrate traces |
Gregorio R. Murtagian, Brent Stone, Kaladhar Radhakrishnan, Joshua D. Heppner |
2018-08-21 |
| 10008452 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Qing Ma, Johanna M. Swan, Robert Starkston, John S. Guzek, Aleksandar Aleksov |
2018-06-26 |
| 10002814 |
Apparatuses and methods to enhance passivation and ILD reliability |
Richard J. Harries, Sudarashan V. Rangaraj |
2018-06-19 |
| 9971089 |
Chip-to-chip interconnect with embedded electro-optical bridge structures |
Zhichao Zhang, Kemal Aygun |
2018-05-15 |
| 9941054 |
Integration of embedded thin film capacitors in package substrates |
Daniel N. Sobieski, Sri Ranga Sai Boyapati |
2018-04-10 |
| 9927211 |
Cloaking system with waveguides |
Ian A. Young, Johanna M. Swan, Marko Radosavljevic |
2018-03-27 |
| 9922916 |
High density package interconnects |
Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu |
2018-03-20 |
| 9918414 |
Electromagnetic interference shields for electronic packages and related methods |
— |
2018-03-13 |
| 9865568 |
Integrated circuit structures with recessed conductive contacts for package on package |
Kyu Oh Lee, Islam A. Salama, Ram Viswanath, Babak Sabi, Sri Chaitra Jyotsna Chavali |
2018-01-09 |