Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9922916 | High density package interconnects | Sanka Ganesan, Zhiguo Qian, Robert L. Sankman, Krishna Srinivasan | 2018-03-20 |
| 9863982 | Bi-directional current sensing circuit | Ranjit Kumar Guntreddi, Zengjing Wu, Gianluca Valentino | 2018-01-09 |