Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103054 | Coupled vias for channel cross-talk reduction | Zhichao Zhang, Tolga Memioglu, Kemal Aygun | 2018-10-16 |
| 10088518 | Apparatus and method for classifying and locating electrical faults in circuitry | Mayue Xie, Jong-Ru Guo, Zhichao Zhang, Zuoguo Wu | 2018-10-02 |
| 10056528 | Interposer structures, semiconductor assembly and methods for forming interposer structures | Kemal Aygun | 2018-08-21 |
| 10026682 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2018-07-17 |
| 10008451 | Bridge interconnect with air gap in package assembly | Chia-Pin Chiu, Mathew J. Manusharow | 2018-06-26 |
| 9922916 | High density package interconnects | Sanka Ganesan, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2018-03-20 |