Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049987 | Enhanced fiducial visibility and recognition | Kyle Yazzie | 2018-08-14 |
| 10008451 | Bridge interconnect with air gap in package assembly | Zhiguo Qian, Mathew J. Manusharow | 2018-06-26 |
| 10008475 | Stacked-die including a die in a package substrate | — | 2018-06-26 |
| 9929119 | High density substrate routing in BBUL package | Weng Hong Teh | 2018-03-27 |
| 9875969 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan, Sujit Sharan | 2018-01-23 |