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Helical plated through-hole package inductor |
William J. Lambert, Mihir K. Roy, Yikang Deng |
2018-12-25 |
| 10121701 |
Substrate conductor structure and method |
Harold Ryan Chase, Mihir K. Roy, Mark S. Hlad |
2018-11-06 |
| 10085341 |
Direct chip attach using embedded traces |
Mihir K. Roy |
2018-09-25 |
| 10008451 |
Bridge interconnect with air gap in package assembly |
Chia-Pin Chiu, Zhiguo Qian |
2018-06-26 |
| 9992871 |
Systems and methods for controlled effective series resistance component |
William J. Lambert |
2018-06-05 |
| 9992859 |
Low loss and low cross talk transmission lines using shaped vias |
Adel A. Elsherbini, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more |
2018-06-05 |
| 9899311 |
Hybrid pitch package with ultra high density interconnect capability |
Daniel N. Sobieski, Mihir K. Roy, William J. Lambert |
2018-02-20 |