Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163557 | Helical plated through-hole package inductor | William J. Lambert, Mathew J. Manusharow, Yikang Deng | 2018-12-25 |
| 10121701 | Substrate conductor structure and method | Harold Ryan Chase, Mathew J. Manusharow, Mark S. Hlad | 2018-11-06 |
| 10103105 | High density organic bridge device and method | Stefanie M. Lotz, Wei-Lun Kane Jen | 2018-10-16 |
| 10085341 | Direct chip attach using embedded traces | Mathew J. Manusharow | 2018-09-25 |
| 10028394 | Electrical interconnect formed through buildup process | Matthew J Manusharow | 2018-07-17 |
| 9999129 | Microelectronic device and method of manufacturing same | John S. Guzek, Brent M. Roberts | 2018-06-12 |
| 9917044 | Package with bi-layered dielectric structure | Zheng Zhou, Chong Zhang, Kyu Oh Lee, Amanda E. Schuckman | 2018-03-13 |
| 9899311 | Hybrid pitch package with ultra high density interconnect capability | Mathew J. Manusharow, Daniel N. Sobieski, William J. Lambert | 2018-02-20 |