Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163863 | Recessed and embedded die coreless package | — | 2018-12-25 |
| 10083936 | Semiconductor package having spacer layer | Weng Hong Teh, Shan Zhong | 2018-09-25 |
| 10008452 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, Robert L. Sankman, Aleksandar Aleksov | 2018-06-26 |
| 9999129 | Microelectronic device and method of manufacturing same | Mihir K. Roy, Brent M. Roberts | 2018-06-12 |
| 9941245 | Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate | Oswald Skeete, Ravi Mahajan | 2018-04-10 |
| 9871026 | Embedded memory and power management subpackage | Debendra Mallik, Sasha N. Oster, Timothy McIntosh | 2018-01-16 |
| 9859253 | Integrated circuit package stack | Saikumar Jayaraman, Yidnekachew S. Mekonnen | 2018-01-02 |