Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941245 | Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate | Ravi Mahajan, John S. Guzek | 2018-04-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941245 | Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate | Ravi Mahajan, John S. Guzek | 2018-04-10 |