Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941245 | Integrated circuit packages including high density bump-less build up layers and a lesser density core or coreless substrate | Oswald Skeete, John S. Guzek | 2018-04-10 |
| 9941246 | Electronic assembly that includes stacked electronic devices | Nitin A. Deshpande | 2018-04-10 |