| 10156583 |
Method of making an accelerometer |
Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more |
2018-12-18 |
| 10116504 |
Package integrated security features |
Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios Dogiamis +1 more |
2018-10-30 |
| 10070524 |
Method of making glass core substrate for integrated circuit devices |
Qing Ma, Quan Tran, Robert L. Sankman, Valluri Rao |
2018-09-04 |
| 10054737 |
Optical I/O system using planar light-wave integrated circuit |
Mauro J. Kobrinsky, Henning Braunisch, Shawna M. Liff, Peter L. D. Chang, Bruce A. Block |
2018-08-21 |
| 10039186 |
Stretchable and flexible electrical substrate interconnections |
Amit S. Baxi, Vincent S. Mageshkumar, Adel A. Elsherbini, Sasha N. Oster, Feras Eid +1 more |
2018-07-31 |
| 10032052 |
Piezoelectric package-integrated delay lines for radio frequency identification tags |
Adel A. Elsherbini, Telesphor Kamgaing, Feras Eid, Vijay K. Nair, Georgios Dogiamis +1 more |
2018-07-24 |
| 10008452 |
Microelectronic structures having laminated or embedded glass routing structures for high density packaging |
Qing Ma, Robert Starkston, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov |
2018-06-26 |
| 9967040 |
Patch system for in-situ therapeutic treatment |
Aleksandar Aleksov, Sasha N. Oster, Feras Eid, Adel A. Elsherbini, Amit S. Baxi +3 more |
2018-05-08 |
| 9952823 |
Architecture for seamless integrated display system |
Uygar E. Avci, Islam A. Salama, Ravi Pillarisetty |
2018-04-24 |
| 9954309 |
Magnetic detachable electrical connections between circuits |
Feras Eid, Sasha N. Oster, Adel A. Elsherbini, Aleksandar Aleksov, Amit S. Baxi +1 more |
2018-04-24 |
| 9927211 |
Cloaking system with waveguides |
Ian A. Young, Robert L. Sankman, Marko Radosavljevic |
2018-03-27 |
| 9902152 |
Piezoelectric package-integrated synthetic jet devices |
Feras Eid, Shawna M. Liff, Sasha N. Oster, Thomas L. Sounart, Georgios Dogiamis +1 more |
2018-02-27 |
| 9893438 |
Electrical connectors for high density attach to stretchable boards |
Sasha N. Oster, Adel A. Elsherbini, Feras Eid, Aleksandar Aleksov, Amit S. Baxi +1 more |
2018-02-13 |
| 9875969 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Sujit Sharan |
2018-01-23 |
| 9865521 |
Copper nanorod-based thermal interface material (TIM) |
Chandra Mohan Jha, Feras Eid, Ashish Gupta |
2018-01-09 |