Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9916266 | High performance interconnect physical layer | Venkatraman Iyer, Darren S. Jue, Robert G. Blankenship, Fulvio Spagna | 2018-03-13 |
| 9865521 | Copper nanorod-based thermal interface material (TIM) | Chandra Mohan Jha, Feras Eid, Johanna M. Swan | 2018-01-09 |