Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10146733 | High performance interconnect physical layer | Venkatraman Iyer, Robert G. Blankenship, Fulvio Spagna, Debendra Das Sharma, Jeffrey C. Swanson | 2018-12-04 |
| 10002095 | High performance interconnect physical layer | Venkatraman Iyer, Sitaraman V. Iyer | 2018-06-19 |
| 9916266 | High performance interconnect physical layer | Venkatraman Iyer, Robert G. Blankenship, Fulvio Spagna, Ashish Gupta | 2018-03-13 |
| 9892086 | High performance interconnect physical layer | Venkatraman Iyer, Rahul C. Shah, Arvind Kumar | 2018-02-13 |