| 10145694 |
Technologies for providing information to a user while traveling |
Ren Wang, Zhonghong Ou, Kristoffer Fleming, Tsung-Yuan C. Tai, Timothy J. Gresham +2 more |
2018-12-04 |
$23,085,000 |
| 10147676 |
Wafer-scale power delivery |
Charles E. Cox, Harald Huels, Xiao Hu Liu, Ahmet S. Ozcan, Winfried W. Wilcke |
2018-12-04 |
$4,080,000 |
| 10133396 |
Virtual input device using second touch-enabled display |
John J. Valavi, Murali Ramadoss |
2018-11-20 |
$25,900,000 |
| 10049942 |
Asymmetric semiconductor device and method of forming same |
Anthony I. Chou, Judson R. Holt, Henry K. Utomo |
2018-08-14 |
$10,336,000 |
| 10032862 |
Semiconductor structure with integrated passive structures |
Anthony I. Chou, Renee T. Mo, Shreesh Narasimha |
2018-07-24 |
$2,645,000 |
| 10025981 |
Visual object and event detection and prediction system using saccades |
Ban Kawas, Janusz Marecki, Sharathchandra U. Pankanti |
2018-07-17 |
$3,360,000 |
| D822658 |
Computer notebook |
Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N. Larsen, Martin Bone +2 more |
2018-07-10 |
|
| 10002900 |
Three-dimensional wafer scale integration of heterogeneous wafers with unequal die sizes |
Mark C. H. Lamorey |
2018-06-19 |
$3,279,000 |
| 10002876 |
FinFET vertical flash memory |
Ramachandra Divakaruni, Carl Radens |
2018-06-19 |
$3,279,000 |
| 9991167 |
Method and IC structure for increasing pitch between gates |
Murshed Chowdhury, Brian J. Greene, Chung-Hsun Lin |
2018-06-05 |
$15,243,000 |
| 9934138 |
Application testing on a blockchain |
Vijay Kumar Ananthapur Bache, Jhilam Bera, Bidhu Ranjan Sahoo |
2018-04-03 |
$2,801,000 |
| 9923082 |
Junction butting structure using nonuniform trench shape |
Anthony I. Chou, Judson R. Holt, Henry K. Utomo |
2018-03-20 |
$13,593,000 |
| 9922831 |
Asymmetric high-k dielectric for reducing gate induced drain leakage |
Anthony I. Chou, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw |
2018-03-20 |
$2,525,000 |
| 9904341 |
Cascading power consumption |
Brian E. Woodruff, David M. Putzolu, Mark R. Walker |
2018-02-27 |
$23,267,000 |
| 9892086 |
High performance interconnect physical layer |
Venkatraman Iyer, Darren S. Jue, Rahul C. Shah |
2018-02-13 |
$15,494,000 |
| 9886193 |
Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration |
Daniel G. Berger, Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Winfried W. Wilcke |
2018-02-06 |
$2,625,000 |
| 9881956 |
Heterogeneous integration using wafer-to-wafer stacking with die size adjustment |
Mark C. H. Lamorey |
2018-01-30 |
$2,622,000 |
| 9870503 |
Visual object and event detection and prediction system using saccades |
Ban Kawas, Janusz Marecki, Sharathchandra U. Pankanti |
2018-01-16 |
$4,196,000 |
| 9859122 |
Asymmetric high-k dielectric for reducing gate induced drain leakage |
Anthony I. Chou, Chung-Hsun Lin, Shreesh Narasimha, Claude Ortolland, Jonathan T. Shaw |
2018-01-02 |
$1,907,000 |
