Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9886193 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2018-02-06 |
| 9859262 | Thermally enhanced package to reduce thermal interaction between dies | Janak G. Patel, Subramanian S. Iyer | 2018-01-02 |