Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147676 | Wafer-scale power delivery | Charles E. Cox, Harald Huels, Arvind Kumar, Xiao Hu Liu, Ahmet S. Ozcan | 2018-12-04 |
| 9886193 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Daniel G. Berger, Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Arvind Kumar | 2018-02-06 |