Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10146733 | High performance interconnect physical layer | Venkatraman Iyer, Darren S. Jue, Robert G. Blankenship, Fulvio Spagna, Debendra Das Sharma | 2018-12-04 |
| 10140240 | Control messaging in multislot link layer flit | Jeff Willey, Robert G. Blankenship | 2018-11-27 |
| 10061719 | Packed write completions | Brian S. Morris, Bill Nale, Robert G. Blankenship, Jeff Willey, Eric L. Hendrickson | 2018-08-28 |