Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121722 | Architecture material and process to improve thermal performance of the embedded die package | Eric J. Li, Zhaozhi Li, Robert M. Nickerson | 2018-11-06 |
| 9865521 | Copper nanorod-based thermal interface material (TIM) | Feras Eid, Johanna M. Swan, Ashish Gupta | 2018-01-09 |