Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121722 | Architecture material and process to improve thermal performance of the embedded die package | Chandra Mohan Jha, Eric J. Li, Robert M. Nickerson | 2018-11-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121722 | Architecture material and process to improve thermal performance of the embedded die package | Chandra Mohan Jha, Eric J. Li, Robert M. Nickerson | 2018-11-06 |