Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10128225 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong | 2018-11-13 | $26,640,000 |
| 10121722 | Architecture material and process to improve thermal performance of the embedded die package | Chandra Mohan Jha, Eric J. Li, Zhaozhi Li | 2018-11-06 | $18,970,000 |