Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128225 | Interconnect structures with polymer core | Sandeep Razdan, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2018-11-13 |
| 10068863 | Formation of solder and copper interconnect structures and associated techniques and configurations | — | 2018-09-04 |
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2018-08-14 |
| 9859248 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas, Lars D. Skoglund +3 more | 2018-01-02 |