Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Mukul Renavikar, Ashay Dani, Edward R. Prack +6 more | 2018-08-14 |
| 9950393 | Hybrid low metal loading flux | Martha A. Dudek, James C. Matayabas, Jr., Michelle S. Phen, Wei Tan | 2018-04-24 |