Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10145758 | Wafer level optical probing structures for silicon photonics | Matthew J. Traverso, Ravi S. Tummidi, Mark A. Webster | 2018-12-04 | $48,685,000 |
| 10128225 | Interconnect structures with polymer core | Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong, Robert M. Nickerson | 2018-11-13 | $26,640,000 |
| 9964719 | Fan-out wafer level integration for photonic chips | Vipulkumar Patel, Matthew J. Traverso | 2018-05-08 | $34,016,000 |