Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10163810 | Electromagnetic interference shielding for system-in-package technology | Yoshihiro Tomita, Nachiket R. Raravikar, Robert L. Sankman | 2018-12-25 | |
| 10121722 | Architecture material and process to improve thermal performance of the embedded die package | Chandra Mohan Jha, Zhaozhi Li, Robert M. Nickerson | 2018-11-06 | $18,970,000 |
| 9991211 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Rajendra C. Dias, Joshua D. Heppner +2 more | 2018-06-05 | $24,427,000 |
| 9953929 | Systems and methods for electromagnetic interference shielding | Rajendra C. Dias, Anna M. Prakash, Joshua D. Heppner, Nachiket R. Raravikar | 2018-04-24 | $19,097,000 |
| 9922751 | Helically insulated twinax cable systems and methods | Zhichao Zhang, Gong Ouyang, Kai Xiao, Kemal Aygun | 2018-03-20 | $13,809,000 |