Issued Patents 2018
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163810 | Electromagnetic interference shielding for system-in-package technology | Eric J. Li, Nachiket R. Raravikar, Robert L. Sankman | 2018-12-25 |
| 10111368 | Flexible substrate retention on a reusable carrier | Joshua D. Heppner | 2018-10-23 |
| 10070520 | Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier | Joshua D. Heppner, Shawna M. Liff, Pramod Malatkar | 2018-09-04 |
| 9991243 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh | 2018-06-05 |
| 9942980 | Wavy interconnect for bendable and stretchable devices | Chuan Hu, Adel A. Elsherbini, Shawna M. Liff | 2018-04-10 |
| 9899238 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh | 2018-02-20 |
| 9866898 | Elementary stream multiplexing method, multiplexing system, encoding or decoding method and apparatus | Kazuhiro Yamashita, Yousuke Yamaguchi, Takafumi Kamito, Yasuo Misuda, Yosuke Takabayashi | 2018-01-09 |
| 9859248 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas +3 more | 2018-01-02 |
| 9860979 | Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer | Takashi Ichiryu, Koji Kawakita, Masanori Nomura | 2018-01-02 |