Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083889 | Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and method for manufacturing the same | Koji Kawakita, Masanori Nomura | 2018-09-25 |
| 9860979 | Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer | Koji Kawakita, Masanori Nomura, Yoshihiro Tomita | 2018-01-02 |