Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157860 | Component stiffener architectures for microelectronic package structures | Kedar Dhane, Yongki Min, William J. Lambert | 2018-12-18 |
| 10109616 | High bandwidth, low profile multi-die package | — | 2018-10-23 |
| 10068852 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Feras Eid, Nitin A. Deshpande, Shawna M. Liff | 2018-09-04 |
| 9991243 | Integrated circuit assembly that includes stacked dice | Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2018-06-05 |
| 9899238 | Low cost package warpage solution | Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2018-02-20 |