Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157860 | Component stiffener architectures for microelectronic package structures | Omkar G. Karhade, Kedar Dhane, William J. Lambert | 2018-12-18 |
| 9911723 | Magnetic small footprint inductor array module for on-package voltage regulator | Reynaldo A. Olmedo, William J. Lambert, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala +1 more | 2018-03-06 |