Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157860 | Component stiffener architectures for microelectronic package structures | Omkar G. Karhade, Yongki Min, William J. Lambert | 2018-12-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157860 | Component stiffener architectures for microelectronic package structures | Omkar G. Karhade, Yongki Min, William J. Lambert | 2018-12-18 |