Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10163557 | Helical plated through-hole package inductor | Mihir K. Roy, Mathew J. Manusharow, Yikang Deng | 2018-12-25 | |
| 10157860 | Component stiffener architectures for microelectronic package structures | Omkar G. Karhade, Kedar Dhane, Yongki Min | 2018-12-18 | $25,622,000 |
| 9992871 | Systems and methods for controlled effective series resistance component | Mathew J. Manusharow | 2018-06-05 | $24,427,000 |
| 9911723 | Magnetic small footprint inductor array module for on-package voltage regulator | Yongki Min, Reynaldo A. Olmedo, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala +1 more | 2018-03-06 | $18,859,000 |
| 9899311 | Hybrid pitch package with ultra high density interconnect capability | Mathew J. Manusharow, Daniel N. Sobieski, Mihir K. Roy | 2018-02-20 | $17,556,000 |