Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10103037 | Flexible microelectronic systems and methods of fabricating the same | Aleksandar Aleksov, Dilan Seneviratne, Charavana K. Gurumurthy, Ching-Ping Janet Shen | 2018-10-16 | $21,459,000 |
| 10070537 | Formation of dielectric with smooth surface | Deepak Arora, Dilan Seneviratne, Ebrahim Andideh, James C. Meyer | 2018-09-04 | $19,235,000 |
| 10026691 | Package substrate having noncircular interconnects | Kristof Darmawikarta, Kyu Oh Lee | 2018-07-17 | $22,904,000 |
| 9941054 | Integration of embedded thin film capacitors in package substrates | Robert L. Sankman, Sri Ranga Sai Boyapati | 2018-04-10 | $20,820,000 |
| 9941219 | Control of warpage using ABF GC cavity for embedded die package | Digvijay A. Rorane, Ian En Yoon Chin | 2018-04-10 | $20,820,000 |
| 9899311 | Hybrid pitch package with ultra high density interconnect capability | Mathew J. Manusharow, Mihir K. Roy, William J. Lambert | 2018-02-20 | $17,556,000 |