Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10111338 | Build-up high-aspect ratio opening | Frank Truong | 2018-10-23 |
| 10103037 | Flexible microelectronic systems and methods of fabricating the same | Aleksandar Aleksov, Charavana K. Gurumurthy, Ching-Ping Janet Shen, Daniel N. Sobieski | 2018-10-16 |
| 10068776 | Raster-planarized substrate interlayers and methods of planarizing same | Frank Truong, Praneeth Akkinepally, Shruti R. Jaywant | 2018-09-04 |
| 10070537 | Formation of dielectric with smooth surface | Deepak Arora, Daniel N. Sobieski, Ebrahim Andideh, James C. Meyer | 2018-09-04 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Rahul N. Manepalli, Srinivas V. Pietambaram, Kristof Darmawikarta, Robert Alan May +1 more | 2018-08-07 |