Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10111338 | Build-up high-aspect ratio opening | Dilan Seneviratne | 2018-10-23 |
| 10068776 | Raster-planarized substrate interlayers and methods of planarizing same | Praneeth Akkinepally, Shruti R. Jaywant, Dilan Seneviratne | 2018-09-04 |