Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10163798 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Islam A. Salama, Robert L. Sankman | 2018-12-25 | |
| 10121679 | Package substrate first-level-interconnect architecture | Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar, Hiroki Tanaka, Sri Ranga Sai Boyapati | 2018-11-06 | $18,970,000 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Rahul N. Manepalli, Dilan Seneviratne, Srinivas V. Pietambaram, Kristof Darmawikarta +1 more | 2018-08-07 | $25,284,000 |
| 9953959 | Metal protected fan-out cavity | Kristof Darmawikarta, Yikang Deng, Amruthavalli Pallavi Alur, Sheng Li, Chong Zhang +2 more | 2018-04-24 | $19,097,000 |