Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121679 | Package substrate first-level-interconnect architecture | Aleksandar Aleksov, Kristof Darmawikarta, Hiroki Tanaka, Robert Alan May, Sri Ranga Sai Boyapati | 2018-11-06 |