Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163798 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2018-12-25 |
| 10121679 | Package substrate first-level-interconnect architecture | Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar, Hiroki Tanaka, Robert Alan May | 2018-11-06 |
| 10043740 | Package with passivated interconnects | Rahul N. Manepalli, Dilan Seneviratne, Srinivas V. Pietambaram, Kristof Darmawikarta, Robert Alan May +1 more | 2018-08-07 |
| 9941054 | Integration of embedded thin film capacitors in package substrates | Robert L. Sankman, Daniel N. Sobieski | 2018-04-10 |