Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121752 | Surface finishes for interconnection pads in microelectronic structures | Kyu Oh Lee | 2018-11-06 |
| 10080290 | Stretchable embedded electronic package | Aleksandar Aleksov, Rahul N. Manepalli | 2018-09-18 |
| 10049996 | Surface finishes for high density interconnect architectures | David Unruh | 2018-08-14 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Rahul N. Manepalli, Dilan Seneviratne, Kristof Darmawikarta, Robert Alan May +1 more | 2018-08-07 |
| 9947631 | Surface finishes for interconnection pads in microelectronic structures | Kyu Oh Lee | 2018-04-17 |
| 9931820 | Mold material for direct metallization | Rahul N. Manepalli | 2018-04-03 |