Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121679 | Package substrate first-level-interconnect architecture | Kristof Darmawikarta, Arnab Sarkar, Hiroki Tanaka, Robert Alan May, Sri Ranga Sai Boyapati | 2018-11-06 |
| 10103037 | Flexible microelectronic systems and methods of fabricating the same | Dilan Seneviratne, Charavana K. Gurumurthy, Ching-Ping Janet Shen, Daniel N. Sobieski | 2018-10-16 |
| 10099307 | Interconnect alloy material and methods | Ting Zhong, Rajashree Baskaran | 2018-10-16 |
| 10080290 | Stretchable embedded electronic package | Srinivas V. Pietambaram, Rahul N. Manepalli | 2018-09-18 |
| 10039186 | Stretchable and flexible electrical substrate interconnections | Amit S. Baxi, Vincent S. Mageshkumar, Adel A. Elsherbini, Sasha N. Oster, Feras Eid +1 more | 2018-07-31 |
| 10008452 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, Robert Starkston, John S. Guzek, Robert L. Sankman | 2018-06-26 |
| 9992859 | Low loss and low cross talk transmission lines using shaped vias | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2018-06-05 |
| 9967040 | Patch system for in-situ therapeutic treatment | Sasha N. Oster, Feras Eid, Adel A. Elsherbini, Johanna M. Swan, Amit S. Baxi +3 more | 2018-05-08 |
| 9954309 | Magnetic detachable electrical connections between circuits | Feras Eid, Sasha N. Oster, Adel A. Elsherbini, Johanna M. Swan, Amit S. Baxi +1 more | 2018-04-24 |
| 9915978 | Method of fabricating a stretchable computing device | Nadine L. Dabby, Lakshman Krishnamurthy, Braxton Lathrop, Adel A. Elsherbini, Sasha N. Oster +1 more | 2018-03-13 |
| 9893438 | Electrical connectors for high density attach to stretchable boards | Sasha N. Oster, Adel A. Elsherbini, Feras Eid, Amit S. Baxi, Johanna M. Swan +1 more | 2018-02-13 |
| 9875969 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Stefanie M. Lotz, Johanna M. Swan, Sujit Sharan | 2018-01-23 |