Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002824 | Magnetic alignment for flip chip microelectronic devices | Ankur Agrawal, Srinivas S. Moola, Vijay Govindarajan | 2018-06-19 |
| 9875969 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Stefanie M. Lotz, Johanna M. Swan | 2018-01-23 |