Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10125013 | Microelectromechanical system with spring for magnet placement | Amanuel M. Abebaw, Liwei Wang, Mark Saltas, Sandeep S. Iyer, Nick Labanok | 2018-11-13 |
| 10008452 | Microelectronic structures having laminated or embedded glass routing structures for high density packaging | Qing Ma, Johanna M. Swan, John S. Guzek, Robert L. Sankman, Aleksandar Aleksov | 2018-06-26 |