Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121679 | Package substrate first-level-interconnect architecture | Aleksandar Aleksov, Arnab Sarkar, Hiroki Tanaka, Robert Alan May, Sri Ranga Sai Boyapati | 2018-11-06 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Rahul N. Manepalli, Dilan Seneviratne, Srinivas V. Pietambaram, Robert Alan May +1 more | 2018-08-07 |
| 10026691 | Package substrate having noncircular interconnects | Kyu Oh Lee, Daniel N. Sobieski | 2018-07-17 |
| 9953959 | Metal protected fan-out cavity | Robert Alan May, Yikang Deng, Amruthavalli Pallavi Alur, Sheng Li, Chong Zhang +2 more | 2018-04-24 |