Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163798 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2018-12-25 |
| 9953959 | Metal protected fan-out cavity | Kristof Darmawikarta, Robert Alan May, Yikang Deng, Sheng Li, Chong Zhang +2 more | 2018-04-24 |