Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163798 | Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman | 2018-12-25 |
| 10043740 | Package with passivated interconnects | Sri Ranga Sai Boyapati, Rahul N. Manepalli, Dilan Seneviratne, Srinivas V. Pietambaram, Kristof Darmawikarta +1 more | 2018-08-07 |
| 9952823 | Architecture for seamless integrated display system | Johanna M. Swan, Uygar E. Avci, Ravi Pillarisetty | 2018-04-24 |
| 9941158 | Integrated circuit and process for fabricating thereof | Charan Gurumurthy, Houssam Jomaa, Ravi Tanikella | 2018-04-10 |
| 9865568 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Ram Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2018-01-09 |