Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157824 | Integrated circuit (IC) package and package substrate comprising stacked vias | Kuiwon Kang, Layal Rouhana, Seongryul Choi | 2018-12-18 |
| 9941158 | Integrated circuit and process for fabricating thereof | Charan Gurumurthy, Islam A. Salama, Ravi Tanikella | 2018-04-10 |
| 9929097 | Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers | Ravi Kiran Nalla, Omar J. Bchir | 2018-03-27 |