Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157824 | Integrated circuit (IC) package and package substrate comprising stacked vias | Houssam Jomaa, Layal Rouhana, Seongryul Choi | 2018-12-18 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157824 | Integrated circuit (IC) package and package substrate comprising stacked vias | Houssam Jomaa, Layal Rouhana, Seongryul Choi | 2018-12-18 |