Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865568 | Integrated circuit structures with recessed conductive contacts for package on package | Kyu Oh Lee, Islam A. Salama, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2018-01-09 |