Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121752 | Surface finishes for interconnection pads in microelectronic structures | Srinivas V. Pietambaram | 2018-11-06 |
| 10076808 | Lead-free solder alloy | Tsukasa Ohnishi, Shunsaku Yoshikawa, Ken Tachibana, Yoshie Yamanaka, Hikaru Nomura | 2018-09-18 |
| 10026691 | Package substrate having noncircular interconnects | Kristof Darmawikarta, Daniel N. Sobieski | 2018-07-17 |
| 9947631 | Surface finishes for interconnection pads in microelectronic structures | Srinivas V. Pietambaram | 2018-04-17 |
| 9917044 | Package with bi-layered dielectric structure | Zheng Zhou, Mihir K. Roy, Chong Zhang, Amanda E. Schuckman | 2018-03-13 |
| 9865568 | Integrated circuit structures with recessed conductive contacts for package on package | Islam A. Salama, Ram Viswanath, Robert L. Sankman, Babak Sabi, Sri Chaitra Jyotsna Chavali | 2018-01-09 |